HP FX700 512GB M.2 2280 NVMe PCIe Gen4x4 SSD
Solid-State-Drive
| Capacity: | 512 GB |
|---|---|
| Variants: | 512 GB 1 TB 2 TB 2 TB |
| Overprovisioning: | 35.2 GB / 7.4 % |
| Production: | Active |
| Released: | Dec 26th, 2023 |
| Part Number: | Unknown |
| Market: | Consumer |
Physical
| Form Factor: | M.2 2280 (Single-Sided) |
|---|---|
| Interface: | PCIe 4.0 x4 |
| Protocol: | NVMe 1.4 |
| Power Draw: | 0.04 W (Idle) Unknown (Avg) 3.2 W (Max) |
Controller
| Manufacturer: | MaxioTech |
|---|---|
| Name: | MAP1602A Falcon Lite |
| Architecture: | ARM 32-bit Cortex-R5 |
| Core Count: | Quad-Core |
| Foundry: | TSMC |
| Process: | 12 nm |
| Flash Channels: | 4 @ 2,400 MT/s |
| Chip Enables: | 4 |
| Controller Features: | HMB (enabled) |
NAND Flash
| Manufacturer: | YMTC |
|---|---|
| Name: | Xtacking 3.0 (X3-6070) |
| Rebranded: | (Rebranded by Biwin) |
| Type: | QLC |
| Technology: | 232-layer |
| Speed: | 2400 MT/s |
| Capacity: | 4 chips @ 1 Tbit |
| ONFI: | 5.0 |
| Topology: | Charge Trap |
| Die Size: | 52 mm² (19.7 Gbit/mm²) |
| Dies per Chip: | 1 die @ 1 Tbit |
| Planes per Die: | 4 |
| Decks per Die: | 2 |
| Word Lines: | 253 per NAND String 91.7% Vertical Efficiency |
| Endurance: (up to) | 1000 P/E Cycles |
| Page Size: | 16 KB |
DRAM Cache
| Type: | None |
|---|---|
| Host-Memory-Buffer (HMB): | 40 MB |
Performance
| Sequential Read: | 6,300 MB/s |
|---|---|
| Sequential Write: | 3,100 MB/s |
| Random Read: | 567,000 IOPS |
| Random Write: | 586,000 IOPS |
| Endurance: | 200 TBW |
| Warranty: | 3 Years |
| MTBF: | 2.0 Million Hours |
| Drive Writes Per Day (DWPD): | 0.2 |
| SLC Write Cache: | Yes |
RM429.00Price







